Mapping Measurement and Mapping Series

Optical Reflective Film Thickness Meter · Wafer-level Full-Wafer Mapping

Wafer-level mapping for circular surveying, 380-1100nm spectral interferometry, 15nm to 70μm non-contact thickness measurement, fully compatible with 2 to 12 inches

 

Product Introduction

The FILMTHICK-C50-Mapping is a wafer-level Mapping measurement device designed for the semiconductor wafer, flat panel display, and precision optical coating industries. Based on the FILMTHICK-C series interferometric film thickness measurement platform, it integrates the R-Theta polar coordinate automatic movement platform, vacuum adsorption wafer stage, and dedicated Mapping measurement and mapping software. The device adopts the principle of reflective spectral interferometric thickness measurement, with a mechanical structure integrating imported long-life halogen tungsten lamp light sources. Combined with a self-developed high-precision spectrometer and three major inversion algorithms—FFT Fourier method, extreme value method, and fitting method—it achieves non-contact, non-destructive, high-precision measurement of wafers from 2 to 12 inches. It covers parameters such as single-layer and multilayer film thickness, refractive index n, extinction coefficient k, reflectivity, and color, and outputs full-sample two-dimensional and three-dimensional film thickness distribution maps.

The OPTICAFILMTEST optical film thickness measurement software features a rich and open material refractive index database, which can display interference, FFT spectra, and film thickness trends in real time during measurement, assisting users in testing and analysis. The hardware adopts a modular design, with core components that can be independently replaced, facilitating subsequent functional expansion. 

 

Core selling points

Wafer-level full-chip mapping: R-Theta polar coordinate automatic platform carries samples for radial and rotational degrees of freedom movement, with the optical system stationary and no assembly consistency differences between points; Automatically generates 2D contour cloud maps, 3D three-dimensional distribution maps, and profile lines; 

 

Fast: single-point measurement time less than 0.5 seconds; 5 points / 5 seconds, 25 points / 14 seconds, 57 points / 30 seconds, significantly reducing detection cycles; 

 

Wide range and high precision: single unit covers 15nm to 70μm, repeatability 0.2nm, stability better than 0.05nm, reducing equipment input and sample switching time; 

 

Full specifications from 2 to 12 inches: 2 / 4 / 6 / 8 / 12 inch wafers can be placed directly on the chip, no need to purchase separate chucks by size; 

 

Six types of scanning paths: circles and concentric circles / rectangles and squares / radial / center or edge removal / 4 fixed points / user-defined, also supports point programming and D distribution;

 

Measurement and simulation integrated: In addition to thickness inversion, it simultaneously provides refractive index n, extinction coefficient k, reflectance, and color; The built-in reflectance simulation module can assist in the development of new film process layers. 

 

Core Technical Parameters (Standard Configuration Indicators)

Product Model	FILMTHICK-C50-Mapping
Optical Principle	Reflective Spectral Interferometry (White Light Interference), Non-contact, Non-destructive Measurement
Spectral Range	380nm - 1100nm (Visible to Near-Infrared)
Light Source	Mechanically integrated imported long-life halogen tungsten lamp light source, lifespan over 3000 hours
Measurement Spot Size	1.5mm (Standard configuration, optional according to sample requirements)
Film Thickness Measurement Range	15nm - 70μm
Film Thickness Repeatability Accuracy	0.2nm (Maximum value from 100 measurements on 100nm SiO₂/Si standard sample)
Film Thickness Absolute Accuracy	0.2% or 2nm (whichever is larger)
Film Thickness Stability	Better than 0.05nm
Measurable Parameters	Film thickness d, reflectance spectrum R(λ), color, refractive index n, extinction coefficient k
Reflectance Simulation	Supports modeling of different film layer structures and simulation of coating system reflectance curves
Algorithm Model	FFT Fourier method, extremum method, curve fitting method, supporting multi-layer film layer-by-layer fitting
Single Point Measurement Time	Less than 0.5 seconds
Mapping Scan Speed	5 points / 5 seconds; 25 points / 14 seconds; 57 points / 30 seconds
Sample Stage Type	R-Theta polar coordinate automatic moving stage (radial and rotational dual degrees of freedom)
Travel Range	Not less than 200mm × 200mm, extendable to 300mm × 300mm
Supported Sample Size	2-inch / 4-inch / 6-inch / 8-inch / 12-inch wafers
Manual Operation Movement Repeatability	±0.2mm (Maximum value from 100 measurements on 100nm SiO₂/Si sample)
Supported Scanning Paths	Circular / rectangular / square / radial / central or edge removal / 4-point / user-defined
Software	OPTICAFILMTEST Optical Film Thickness Measurement Software (Mapping Wafer Measurement Version), Windows 10 / 11 64-bit; built-in open refractive index material database
User Permissions	Manager / Operator / Controller three-level permission management
Data Export	CSV / Excel / XML and 2D, 3D graphical files
System Integration	Supports interfacing with upper-level MES / SPC systems (interfaces open according to projects)
Operating Environment	Temperature 18-28°C, humidity <80% without condensation; AC 220V±10%, 50Hz

 

 

Model	UV	UVX	Basic model	NIRX	NIR
Wavelength Range	190-1100nm	190-1700nm	380-1100nm	380-1700nm	950-1700nm
Light Source	Deuterium lamp, Halogen tungsten lamp		Halogen tungsten lamp
Thickness Range	1nm-40um	1nm-250um	10nm-100um	10um-250um	100um-250um
Accuracy	0.02nm	0.02nm	0.02nm	0.02nm	0.1nm

*The final right of interpretation of this technical specification belongs to the manufacturer.

 

Applicable Industries and Application Scenarios

Semiconductor Wafer Coating Uniformity

Flat Panel Display (FPD)

Precision Optical Coating

New Energy and Photovoltaics

Life Sciences and Biomedical

Micro-LED and Optical Communication

 

Typical Measured Film Data

Samples and Coatings	Measured Thickness	Application Areas
SiO₂ (Silicon Dioxide)	2108nm	Optical Coatings and Passivation Layers
ITO (Indium Tin Oxide)	36nm	Touch Screens and Smart Windows
Parylene	2490nm	Protective Layers for Medical Implants
Microlens Coating	3012nm	Optical Components

*The above accuracy indicators were measured on standard 100nm SiO₂/Si samples under room temperature conditions of 23±2℃. The actual measurement data comes from records of the FILMTHICK-C series on real customer samples, and the feasibility of measurements on specific samples is subject to the results of sample submission and actual measurement.

 

Branch Models (Same platform, branched according to sample type)  

Branch models of FILMTHICK-C50-XY C50-Mapping  

Designed for square and non-standard substrate samples. It uses an XY rectangular coordinate positioning displacement platform, allowing point collection and index editing or import in Cartesian coordinates, to acquire spectra point by point and invert the thickness. It is suitable for scenarios focusing only on a few designated inspection locations, as well as point measurements of rectangular, strip-shaped, or irregular substrates.

Wavelength Range	380nm - 1700nm (VIS and NIR dual detectors, seamless data stitching)
Film Thickness Measurement Range	10μm - 250μm (conventional coatings, medium to thick films preferred)
Film Thickness Repeatability	≤0.02nm
Film Thickness Absolute Accuracy	≤0.2% or 2nm (whichever is greater)
Platform Type	XY right-angle coordinate dual-axis precision motion platform (servo, ball screw, grating ruler closed-loop)
Effective Travel	300mm × 300mm, expandable to 400mm × 400mm
Positioning Accuracy	≤ ±5μm
Repeat Positioning Accuracy	≤ ±2μm
Minimum Step Size	1μm
Movement Speed	0 - 200mm/s
Point Capacity	Single recipe supports over 200 points
Point Arrangement	Matrix automatic generation / manual coordinate input / mouse click selection / CSV and Excel point table import
Overall Machine Configuration	Floor-standing integrated steel cabinet, approximately 600mm × 750mm × 1500mm
Safety Configuration	Front door observation window, door safety interlock, emergency stop button, compliant with IEC 60825-1

*The final right of interpretation of this technical specification belongs to the manufacturer.

 

Standard Configuration

Host (including self-developed high-precision spectrometer and optical path)	1 unit
Imported long-life halogen-tungsten lamp light source	1 set
Measurement software (pre-installed license, three-level permission management)	1 set
SiO₂/Si standard calibration samples	1 set
Chinese operation manual, software manual, and calibration certificate	1 set
Common tool kit and spare consumables	1 set
Remote diagnosis and online upgrade module	1 set
Transport packaging box	1 set

 

 

Service Commitment

Installation and Training	Provide online remote training and on-site installation services; after installation, operation training is conducted, covering instrument operation, software usage, measurement methods, and data analysis.
Warranty Period	One-year free warranty from the date of purchase; quality issues within the warranty period are repaired free of charge and faulty components are replaced; lifetime maintenance at cost price is provided after the warranty period.
Response Time	Response within 8 working hours on weekdays; first response within 4 hours in emergencies.
On-site Service Time	On-site service within 24 hours in Guangzhou and surrounding areas, within 48 hours in South China, and within 72 hours in major provincial capitals nationwide.
Spare Parts Support	Provide solutions for faulty components within 7 working days; commonly used consumables and vulnerable parts are stocked locally.
Calibration and Measurement	Provide national metrology institute or third-party traceable calibration certificates (CNAS optional).
Sample Testing	Before contract signing, free sample testing can be arranged, with actual measurement evaluation coefficients and repeatability data provided.
Software Upgrade	Free upgrades within the instrument’s service life (same model); remote diagnostics and online upgrade modules are provided.

 

 

Why Choose Jingyi Optoelectronics?

Independent R&D

The film thickness inversion algorithms (FFT Fourier method, extremum method, curve fitting method) and the OPTICAFILMTEST measurement software are all independently developed by our company; the spectral acquisition module uses a self-developed high-precision spectrometer.

 

National High-Tech Enterprise

Founded in 2013, our company is recognized as a National High-Tech Enterprise, a specialized and innovative enterprise, and a 'Little Giant' enterprise in technological innovation; we maintain long-term collaborations with universities and research institutes such as Tsinghua University and Peking University.

 

Localized Service

Our Guangzhou headquarters provides direct service nationwide, offering online remote training, on-site installation, remote fault diagnosis, and rapid spare parts delivery; the service chain is shorter compared to the indirect models of imported brands through agents.

 

Sample Testing Verification

Before signing a contract, we can arrange free sample testing, providing actual measurement evaluation coefficients and repeatability data as a basis for configuration confirmation and acceptance.

 

Consult customer service to obtain detailed materials and exclusive solutions.

Tel: 400-1800-685

Email:info@gzjygd.com